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PE/Specialist-Die Bond

Chongqing, Chongqing Shi, CN

Jul 16, 2021
8338

Be part of our team!

AT&S is one of the globally leading manufacturers of high-end printed circuit boards and IC substrates and belongs to the global technology leaders. With more than 10.000 employees worldwide, plants in Austria, China, India, Korea, and Sales Support Offices around the globe. To facilitate our continuous global policy of expansion, we are constantly looking for young talents and experienced professionals with high commitment and ideas that make a difference. Engagement and flexibility are essential factors for our consequent policy of growth. Due to our permanent international growth we expand our Engineering team in Chongqing, China and are looking for an experienced, passionate

 

Die Bond Engineer

 

Your Responsibilities:

1.Develop, design and qualification of new products, technologies, equipment, material, processes and production lines
2.Define new product, process and equipment specifications
3.Provide feasibility studies of new concepts and ideas
4.Define and implement measurements to ensure product quality
5.Liaison with external suppliers (equipment, material or chemical suppliers) and internal relevant departments for technological development and process improvement
6.Take responsibility in new process qualification and new product implementation
7.Ensure stable and robust process with full procedure compliance to manufacture high quality and reliable products
8. Actively participate or drive project for new process qualification, new product implementation
9.Continuously improve the process capability, quality, yield, productivity and resource optimization
10.Train the new employees and transfer know-how to other engineers to relevant departments and other plant
11.Document know-how and keep updating quality related details so as to handover the well-established processes for mass production

 

Your Profile:

1. Bachelor or above
2. Knowledge of project management, data evaluation and design of experiments
3. Knowledge of quality tools like SPC, MSA, DOE, FMEA, CP, etc
4. Good analytical skills with attention to details.
5. Good stress management skills
6. Process engineering experience in IC-Substrate, HDI-PCB, Assembly, IC-Packaging or related industry
7. Fluent written and oral English (Mandarin would be of advantage)
8. Open minded approach
9. Good team working spirit and leadership skills
10.Good communication and negotiation skills
11.Computer skills – MS Office Package (Word, Excel)

 

If you are looking for a new challenging task please send us your application and your detailed resume. It´s just a click to apply online and we are looking forward to it.

Your HR Team!