Be part of our team!

AT&S is a leading global manufacturer of high-end IC substrates and printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments Mobile Devices & Substrates, Automotive & Aerospace, Industrial and Medical and high-performance computing for AI applications. We are looking for talent eager to shape the future of our interconnected world. With plants in Austria, China, India, Malaysia and sales offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the drive to make a difference. 

To enhance our successful TDI-MODULE-CHQ2 Team in China in  Chongqing, we are looking for a passionate

Senior Specialist II TDI-TD Module CHQ 2  (Relam)

Your Responsibilities

• Responsible for Relam process initial preparation and qualification on new project technologies, equipment, materials and processes for mass production purpose
• Define relevant processes, equipment or tools specifications & project timeline for new projects. (including purchase request preparation)
• Execution of feasibility studies on new engineering concepts and hypothesis
• Definition and implementation of measurement rule or guideline to secure and achieve customer requirements or yield target
• Liaise with external suppliers (equipment, material or chemical suppliers) and relevant departments for technological development and advancement
• Generates written documentation of procedures, additional study, design guideline & standard specification. (including training to related deparment)
• Ensure new process stability and robustness which compliance with full processes to achieve high quality and reliable products
• Involvement in Intelligence disclosure idea sharing or submission
• Continuous justification or fulfillment on cost saving, resources optimization & EHS requirements
• Willingness to support assignment task beyond working hour
• Proactive in approaching superior or related reporting line for guidance and outcome alignment
• Provide technical know-how guidance & documentation preparation guideline to team members

Your Profile

• Minimum education level from Bachelor Degree in engineering basis
• Knowledge of project management, data analysis and design of experiments
• Knowledge of data analysis tools (such as SPC, MSA, DOE, FMEA, CP, etc)
• Minimum 6 years of Engineering experience in IC-Substrate, HDI/mSAP-PCB, Assembly, IC-Packaging or related industry especially in Relam process
• Minimum 4 years Working experience with multinational or intercultural teams
• Good analytical skills with attention to details
• Good stress management skills
• Fluent written and oral English (Mandarin would be of advantage)
• Open minded approach and willing to overcome new challenges
• Good team working spirit
• Good communication and negotiation skills
• Computer skills – MS Office Package (Word, Excel, Powerpoint etc)
• Willingness to travel and stay abroad for certain period of time
• Take lead and coordinate for cross department deal on new projects or given tasks
• Good presentation skills for any meeting occasion

Ready for a new challenge to advance your career? It´s just a click to apply online. We look forward to your application and your detailed resume. Your AT&S Team!

AT&S is an equal opportunity employer. We embrace diversity and are dedicated to empowering people to reach their potential by fostering their unique talents and strengths. Our compensation packages are competitive and take individual qualifications and experience into consideration.