Technical Team Leader - IC Substrate Manufacturing (m/f/d)

Leoben, Styria, AT

May 14, 2023

Be part of our team!

AT&S, a world leading high-tech PCB & IC substrates company, is building a brand new R&D and Innovation center at our Headquarters in Leoben (AT) in the picturesque Upper Styria. Focusing on substrate and packaging solutions for the semicon industry, we are looking for committed talents and professionals who want to contribute to the technological progress of our interconnected world and be part of an exciting growth. With plants in Austria, China, India, Korea and offices around the globe, we offer excellent career opportunities for creators, innovators and enablers with the will to make a difference. We are seeking for an experienced candidate to fill the newly created position of


Technical Team Leader – IC Substrate Manufacturing (m/f/d)


As Technical Team Leader in the field of Semicon/IC Substrate Manufacturing, you will take over the technical ownership of process modules within the Mechanical- (Laser drilling/Lamination) or Backend- (Test/Assembly) Production Department. You will be part of setting up the first European factory for IC substrates and bringing it from qualification phase to high volume manufacturing. 

Your responsibilities

  • Representation of AT&S as a reliable interface to leading customers, key suppliers and important internal stakeholders
  • Ownership and technical responsibility for the assigned processes with strong focus on utilizing statistical tools, Six_Sigma and lean production management
  • Lead the technical team within the assigned production department 
  • Driving standardizing and process control, improving yield and optimizing throughput
  • Keeping an up-to-date overview on state of the art equipment in IC-substrate and screening of emerging innovative technologies 
  • Protection of Intellectual Property (IP) and assurance of the company and key customer interests in a highly competitive industry 
  • Follow department KPIs, process cost reduction, efficiency improvement and support yield roadmaps and plant targets

Your Profile

  • University degree (Material Science, Mechanical, Electronic, Chemical Engineering)
  • Minimum of 5 years’ experience as Engineer in the fields of IC-Substrate, Semiconductor, IC-Packaging or Assembly (2 years in smaller team lead function advantageous 
  • Knowledge of project management, data evaluation, design of experiments and customer orientation
  • Experience in practicing Six Sigma or other statistical and quality tools in process engineering and control such as SPC, MSA, DOE, FMEA, CP
  • Computer knowledge in MS Office (Word, Excel), JMP and Minitab 
  • Good analytical skills with attention to details, “out of the Box” thinking and good time management
  • Excellent English and German skills 



Our Offer

  • Personal and professional growth opportunities in a multinational, dynamic company

  • Chance to actively contribute to AT&S´ success and to create value

  • A secure position with long-term career perspective in an internationally expanding environment

  • Attractive and competitive compensation package

  • Flexibility through state of the art technological equipment and the possibility of remote work (home office or shared office Graz)


If you are looking for a new challenging task please send us your application and your detailed resume. It´s just a click to apply online and we are looking forward to it. Your HR Team! 

This position is subject to the collective agreement for workers and employees in the electrical and electronics industry, employment group G. A higher payment is negotiable depending on your expertise and skills.